MVP-5100-MXM Series

Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms

Datasheet: Download

Key Features

9th Gen Intel® Core™ i7/i5/i3 LGA processor
Dual SODIMMs sockets for up to 32GB DDR4
Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
3x USB 3.1 Gen 1, 3x USB 2.0
Rich storage options: 2x 2.5″ SATA, M.2 2280
Front accessible I/O and adaptive Function Module 2.0 options
Embedded slots for Mini PCIe, M.2 3042, 2x USIM
World leading embedded GP/GPU computing options built-in

Ordering Information

MVP-510A-MXM/M4G/[GPU]

Intel® Core™ i7-9700E, 4GB non-ECC DDR4
MVP-5101-MXM/M4G/[GPU]

Intel® Core™ i7-9700TE, 4GB non-ECC DDR4
MVP-5102-MXM/M4G/[GPU]

Intel® Core™ i5-9500TE, 4GB non-ECC DDR4
MVP-5103-MXM/M4G/[GPU]

Intel® Core™ i3-9100TE, 4GB non-ECC DDR4
EGX-MXM-P1000

NVIDIA® Quadro® Embedded P1000, 47W, 512 CUDA Cores, GDDR5 4GB
EGX-MXM-P2000

NVIDIA® Quadro® Embedded P2000, 58W, 768 CUDA Cores, GDDR5 4GB

Accessory

Storage

Factory Installed 2.5″ SSD/HDD/M.2 Storage
Wireless Mini PCIe/M.2 Module

Wi-Fi/ BT/ 3G/ 4G LTE/ LoRa wireless kit (w/ antenna)
AC/DC Adapter

220W (P/N: 31-62149-0000)
280W (P/N: 31-62162-1010-A0)

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Key Features

Built-in ADLINK SEMA 3.0 management solution

6th Gen Intel® Core™ i7/i5/i3 Processors and QM170 chipset

Single-side I/O with two SATA drive bays for easy drive swapping

1x DVI-I, 2x DisplayPort, 4x USB 2.0, 4x USB 3.0, 4x GbE ports, 6x COM ports, and 8x isolated DI/O

Rich Storage Options, 2x 2.5″ SATA III (6.0 Gb/s) bay, 1x M.2 2280 slot, 1x CFast socket

Versatile connection via 2x mPCIe slot and 2 x USIM slot

Rugged construction delivering fanless -20°C to 60 (70)°C operability (w/industrial SSD)

Compliant with railway EMC standard (EN50121)

Key Features

9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset

Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory

Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0

2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0

Rich storage: 2x 2.5″ SATA 6 Gb/s, CFast, M.2 2280

Embedded expansion: Mini PCIe, M.2 3042, 2x USIM

Front accessible I/O and adaptive Function Module v.2 option

Key Features

Intel® Celeron® QC N3160/DC N3060 SoC processor

DDR3L 2x SODIMM up to 8GB

3x independent displays: DP, VGA (Optional LVDS or DP)

Built-in ADLINK SEMA management solution

3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO

Optional: extra 2x RS-232/422/485, TPM2.0, amplifier

2x USB 3.0, 5x USB 2.0, 1x 2.5″ SATA, CFast, Mini PCIe, I2C

Last generation to support Windows 7 OS

Key Features

Quad-Core Intel® Atom™ E3845 processors

Single side I/O with easy access SATA drive bay

Compact 210 (W) x 170 (D) x 70 (H) mm housing

Built-in ADLINK SEMA management solution

Rugged construction delivering fanless -40°C to 70°C operability (w/industrial SODIMM & SSD) *

DVI-I+DisplayPort, 6x USB 2.0, 1x USB 3.0, 3x GbE, 6x COM ports, 16x isolated DI/O, 1x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots

Ignition power input (with MXE-1401V)

Phoenix Contact

MVP-5100-MXM Series

Key Features

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Phoenix Contact

MVP-5100-MXM Series

Key Features

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