The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.
To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.
SMARC Reference Carrier Board, to be used along with LEC-iMX6, LEC-BT, LEC-BTS, LEC-BW
SMARC Short Size Module with Intel® Celeron™ N2807, dual core, 2 GB DDR3L, 0°C to 60°C
SMARC Short Size Module with Intel® Atom™ E3845, quad core, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
SMARC Short Size Module with Intel® Atom™ E3805, dual core, headless, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
SMARC Short Size Module with Intel® Atom™ E3845, quad core, 4 GB DDR3L, -40°C to +85°C
SMARC Short Size Module with Intel® Atom™ E3815, single core, 2 GB DDR3L, -40°C to +85°C
SMARC Short Size Module with Intel® Atom™ E3826, dual core, 2 GB DDR3L, Extreme Rugged operating temperature: -40°C to +85°C
Heatspreader for LEC-BTS