Introduction

The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.

The module primarily targets embedded intelligent systems used in several vertical market segments such as healthcare, industrial controllers and real-time systems, retail systems, edge IOT gateways, in-vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The LEC-AL supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2, Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, enhanced MIPI CSI camera, and a state-of-the-art HD Audio interface.

The module generates its own LVDS (18/24bit), TMDS, and Display Port ++ video signals using eDP and DDI output from the SoC. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC.

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