Categories
Máy tính công nghiệp ADLINK
- PLASTIM
- Uncategorized
KAI SUH SUH
- RJ45 Modular Plug And Plug Cover
- Bushings
- Cable Clamps
- Cable Marker
- Cable Tie
- Fasteners
- Terminal
- Cord End Terminal
- Cord End Terminal (double)
- Male Lug
- Non Insulated Cord End
- Blade Terminal
- Flanged Spade Terminal
- Fully Receptacle
- Hook Terminal
- Insulated Bullet
- Insulated Ring Terminal
- Insulated Ring Terminal Easy Entry
- Insulated Y Terminal
- Insulated Y Terminal Easy Entry
- Pin Terminals
- Ring Terminal
- Y Terminal
- Tubes
- Wire Connectors
- Wrapping Bands
PHOENIX CONTACT
- SCHNEIDER
Phoenix Contact
LEC-AL
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
Datasheet: Download
- Dual or quad-core Intel Atom® E3900 Series or Pentium™ N4200 or Celeron™ N3350 Processor SoC
- Up to 8 GB DDR3L at 1867 MHz
- Triple display support
- HEVC H.265, Dual channel LVDS, HDMI/DP++, DP++, and 2x MIPI CSI camera (2/4 lanes)
- 1x GbE with IEEE1588 (PTP) supported
Introduction
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
The module primarily targets embedded intelligent systems used in several vertical market segments such as healthcare, industrial controllers and real-time systems, retail systems, edge IOT gateways, in-vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The LEC-AL supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2, Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, enhanced MIPI CSI camera, and a state-of-the-art HD Audio interface.
The module generates its own LVDS (18/24bit), TMDS, and Display Port ++ video signals using eDP and DDI output from the SoC. Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings have corrupted the system. Under the management of the BMC chip (Board Management Controller), the SEMA utility (Smart Embedded Management Agent) provides system control, security, and failure protection— counting, monitoring, and measuring hardware and software events, and using the SMBus to send corrective commands to the SoC.
Ordering information
-
LEC-AL-E3930-2G-16G-ERSMARC Short Size Module with Intel Atom® E3930, dual core, 2 GB DDR3L, 16GB eMMC, -40°C to 85°C
-
LEC-AL-E3940-4G-32G-ERSMARC Short Size Module with Intel Atom® E3940, quad core, 4GB DDR3L, 32GB eMMC, -40°C to 85°C
-
LEC-AL-E3950-8G-32G-ERSMARC Short Size Module with Intel Atom® E3950, quad core, 8GB DDR3L, 32GB eMMC, -40°C to 85°C
-
LEC-AL-N3350-4G-16G-CTSMARC Short Size Module with Intel® Celeron™ N3350, dual core, 4GB DDR3L, 16GB eMMC, 0°C to 60°C
-
LEC-AL-N4200-8G-32G-CTSMARC Short Size Module with Intel® Pentium™ N4200, quad core, 8GB DDR3L, 32GB eMMC, 0°C to 60°C
-
*other configurations by request
-
LEC-BASE 2.0SMARCR evaluation carrier board for SMARCR 2.0 compliant modules
-
LEC-AL-HS1Heat spreader for LEC-AL-E3930/E3940/E3950
-
LEC-AL-HS2Heat spreader for LEC-AL-N3350/N4200
-
LEC-AL-HS3Active heatsink for LEC-AL
-
LEC-AL-HS4Integral passive heatsink for LEC-AL-E3930/E3940/E3950
-
LEC-AL-HS5Integral passive heatsink for LEC-AL-N3350/N4200
-
LEC-Starterkit 2.0LEC-Starterkit with LEC-BASE 2.0 carrier, LVDS display, SD card and ATX power supply (without LEC module and cooling solution)
Sản phẩm tương tự
-
SMARC
LEC-BTS
Đọc tiếpSMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
Datasheet: Download
Key Features
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
- HDMI and LVDS
- GbE, camera interface
- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
- Extreme Rugged™ operating temperature: -40°C to +85°C
-
SMARC
LEC-Starterkit 2.0
Đọc tiếpLEC-Starterkit with LEC-BASE 2.0 carrier, SD card and ATX power supply (without LEC module and cooling solution), optional LVDS display
Datasheet: Download
Key Features- SMARC 2.0 compliant LEC-BASE 2.0
- SD card and USB stick
- ATX power supply, US power cord, EU power cord
- LVDS display (optional)
-
SMARC
LEC-PX30
Đọc tiếpSMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
Datasheet: Download
Key Features- Rockchip PX30 with Quad-core ARM Cortex-A35
- Cryptography Extensions for end-to-end IoT security
- 3D Graphics over MIPI DSI 4 lanes or LVDS 24-bit
- Camera MIPI CSI 4 lanes
- Camera MIPI CSI 4 lanes
-
SMARC
LEC-iMX6
Đọc tiếpSMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
Datasheet: Download
Key Features- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management
- Freescale SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad Core processor
- Onboard DDR3L/1067 system memory from 512 MB to 2 GB
- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
- Extreme Rugged temperature range: -40°C to +85°C

Giỏ hàng
Liên hệ:
Phoenix Contact
ADLINK – Máy tính Công nghiệp
KSS (đầu Cos, phụ kiện KSS)
Đánh giá
Chưa có đánh giá nào.