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• IPC Systems

  DLAP-3200-CF Series

  

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  Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

  Datasheet: Download

  Key Features

  • ADLINK MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
  • Reliable Molex type 12V DC-in connector
  • 1x Intel® i219-LM and 3x Intel® i210-AT
  • 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support

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• IPC Systems

  DLAP-4000 Series

  

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  Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

  Datasheet: Download

  Key Features

  • NVIDIA® Quadro® PEG card support
  • 8th/9th Gen Intel® Core™ i7/i5/i3 processor
  • Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)
  • 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards
  • 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module
  • 300W/500W Flex ATX PSU

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• IPC Systems

  DLAP-8000 Series

  

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  9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation

  Datasheet: Download

  Key Features

  • 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset
  • Dual SODIMMs for up to 64GB DDR4 / ECC options*
  • Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0
  • 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0
  • Up to 4 hot swappable 2.5″ SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280
  • Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
  • Front accessible I/O and adaptive Function Module v.2 option
  • Flexible and powerful PCIe expansions via backplane

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• IPC Systems

  DLAP-3100-CF Series

  

  Quick view

  Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

  Datasheet: Download

  Key Features

  • ADLINK MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
  • Reliable Molex type 12V DC-in connector
  • 1x Intel® i219-LM) and 5x Intel® i210-AT

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