Thien Son Technology Corporation
Hotline: 1900 6697
Hotline: 1900 6697

DLAP-3000-CF Series

Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

Datasheet: Download

Key Features

  • ADLINK MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module
  • Reliable Molex type 12V DC-in connector
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Danh mục:


ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: – Smallest Embedded GPU Platform (3 liters) – Reliable MXM GPU Design with Low TDP – Scalable Graphics Processing Ranging from Pascal to Turing GPUs

Ordering information

Ordering Information
  • DLAP-3000-CFP1
    Support EGX-MXM-P1000, Chipset H310, DC-in 12V
  • DLAP-3000-CFP2
    Support EGX-MXM-P2000, Chipset H310, DC-in 12V
  • DLAP-3000-CFP12
    Support EGX-MXM-P1000/P2000/ T1000/RTX3000/RTX5000 (not incl.), Chipset H310, DC-in 12V
  • DLAP-3000-CFT1
    Support EGX-MXM-T1000, Chipset H310, DC-in 12V
  • DLAP-3000-CFT3
    Support EGX-MXM-RTX3000, Chipset H310, DC-in 12V
  • DLAP-3000-CFT5
    Support EGX-MXM-RTX5000, Chipset H310, DC-in 12V

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