Thien Son Technology Corporation
Hotline: 1900 6697
Hotline: 1900 6697

Danh mục: Integrated Fanless Embedded PCs

Integrated Fanless Embedded PCs

Hiển thị tất cả 6 kết quả

  • MVP-5100-MXM Series

    Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms

    Datasheet: Download

    Key Features

    • 9th Gen Intel® Core™ i7/i5/i3 LGA processor
    • Dual SODIMMs sockets for up to 32GB DDR4
    • Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
    • 3x USB 3.1 Gen 1, 3x USB 2.0
    • Rich storage options: 2x 2.5″ SATA, M.2 2280
    • Front accessible I/O and adaptive Function Module 2.0 options
    • Embedded slots for Mini PCIe, M.2 3042, 2x USIM
    • World leading embedded GP/GPU computing options built-in
    Đọc tiếp
  • MXE-1400 Series

    Intel® Atom™ E3845 Processor-Based Fanless Embedded Computer

    Datasheet: Download

    Key Features

    • Quad-Core Intel® Atom™ E3845 processors
    • Single side I/O with easy access SATA drive bay
    • Compact 210 (W) x 170 (D) x 70 (H) mm housing
    • Built-in ADLINK SEMA management solution
    • Rugged construction delivering fanless -40°C to 70°C operability (w/industrial SODIMM & SSD) *
    • DVI-I+DisplayPort, 6x USB 2.0, 1x USB 3.0, 3x GbE, 6x COM ports, 16x isolated DI/O, 1x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots
    • Ignition power input (with MXE-1401V)
    Đọc tiếp
  • MXE-1500 Series

    Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
    Datasheet: Download

    Key Features

    • Intel® Celeron® QC N3160/DC N3060 SoC processor
    • DDR3L 2x SODIMM up to 8GB
    • 3x independent displays: DP, VGA (Optional LVDS or DP)
    • Built-in ADLINK SEMA management solution
    • 3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO
    • Optional: extra 2x RS-232/422/485, TPM2.0, amplifier
    • 2x USB 3.0, 5x USB 2.0, 1x 2.5″ SATA, CFast, Mini PCIe, I2C
    • Last generation to support Windows 7 OS
    Đọc tiếp
  • MXE-5400

    Powerful 4th Generation Intel® Core™ i7 Processor-Based Fanless Embedded Computer
    The MXE-5400 is scheduled for discontinuation as of 2021/02/28. The recommended replacement product is MXE-5500MVP-5100.

    Datasheet: Download

    Key Features

    • Equipped with 4th generation Intel® Core™ i7-4700EQ processor
    • Intel® Quick Sync Video technology supported with ADLINK MSDK+
    • Intel® vPro™ technology for security and manageability (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT™)
    • Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
    • 2x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots (one supporting mSATA SSD)
    • DVI-I+2x DisplayPorts, 6x USB 3.0, 4x GbE ports, 8x isolated DI/O
    • Rugged design for -20ºC to 60ºC fanless operation (w/industrial SSD
    Đọc tiếp
  • MXE-5500 Series

    6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer

    Datasheet: Download

    Key Features

    • Built-in ADLINK SEMA 3.0 management solution
    • 6th Gen Intel® Core™ i7/i5/i3 Processors and QM170 chipset
    • Single-side I/O with two SATA drive bays for easy drive swapping
    • 1x DVI-I, 2x DisplayPort, 4x USB 2.0, 4x USB 3.0, 4x GbE ports, 6x COM ports, and 8x isolated DI/O
    • Rich Storage Options, 2x 2.5″ SATA III (6.0 Gb/s) bay, 1x M.2 2280 slot, 1x CFast socket
    • Versatile connection via 2x mPCIe slot and 2 x USIM slot
    • Rugged construction delivering fanless -20°C to 60 (70)°C operability (w/industrial SSD)
    • Compliant with railway EMC standard (EN50121)
    Đọc tiếp
  • MXE-5600 Series

    9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer

    Datasheet: Download

    Key Features

    • 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset
    • Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
    • Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0
    • 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0
    • Rich storage: 2x 2.5″ SATA 6 Gb/s, CFast, M.2 2280
    • Embedded expansion: Mini PCIe, M.2 3042, 2x USIM
    • Front accessible I/O and adaptive Function Module v.2 option
    Đọc tiếp